00051115527739

description

• 3M™ Thermally Conductive Acrylic Interface Pad 5571 is designated to provide a preferential heat transfer path between heat generating components like integrated circuit chip and heat spreaders as aluminum heat sink.

features

• High thermal conductivity, 2.0 W/m-K on plane direction
• Good softness and conformability even to non-flat IC surfaces and heat spreading blocks
• Passes UL 94 V-0 flame retardance test
• No siloxane outgassing or oil bleeding
• Soft compliant material allows for pressure relaxation, preventing high pressure zones on components
• Good electrical insulation properties
• Slight tack allows easy pre-assembly
• Good wetting performance for better thermal conductivity