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- 50 ml Container Size
- Clear Color
description
- 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.
features
- Features a 70 minute work life
- Rigid potting compound is non-corrosive to copper
- Minimal exotherm and very low shrinkage
- Flammability testing per UL94 HB
| Set Time | >25 min, 3 hr |
| Flame Retardant | UL94 HB |
| Storage Temperature [Min] | 72 ⁰F |
| Setting Time | 3 h |
| Viscosity Range (CPS) @ Room Temperature | 12,000 |
| Container Size | 1.69 fl oz, 50 ml |
| Product Form | Each |
| Specific Gravity | 1.08 |
| Application | Hard Disk Drive Component Assembly, Potting |
| Storage Temperature [Max] | 72 ⁰F |
| Assembly Type | Potting and Encapsulating |
| Mixing Ratio | 1:1 |
| Shear Strength | 2500 psi |
| Shelf Life | 15 Months |
| Full Cure Time | 48 hr @ 72 F (22 C) |
| Physical Form | Liquid |
| Adhesive | Epoxy |
| Open Time @ 72 °F | 60 min |
| Color | Transparent |
| Hardness | 83 Shore D |
| Storage Temperature | 72 °F |
| Open Time | 60 min @ 72 ⁰F |
| Weight | 0.0 LB |
| EAN or UPC | 21200822483 |
