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- 124.7 Kg Drum
- Thermal Coupling of Electrical/Electronic Devices to Heat Sinks
description
- White, non-flowing, highly filled compound, good thermal conductivity.
applications
- • Thermal coupling of electrical devices • PCB assemblies to heat sinks
features
- • Thermally conductive compound • One part • Non flowing • No need for ovens or curing • Increases reliability with heat flow away from circuitry components
caution
- Must be filled to the proper level with the recommended lubricant for your application before operation
| Dielectric Strength, Volts per mil | 450 |
| Type | Heat Sink |
| Container Type | Drum |
| Application | Heat Sink |
| Container Size | 124.7 kg |
| Evaporation Percent | 1.1% @ 390 °F |
| Color | White |
| Base Oil | silicone |
| NLGI No. | 2 |
| NSF | None |
| Thickener Type | Zinc Oxide |
| Temperature Range [Max] | 390 °F |
| Temperature Range [Min] | -40 °F |
| Weight | 274.964 LB |
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