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- 9 Kg Pail
- Thermal Coupling of Electrical/Electronic Devices to Heat Sinks
description
- White, non-flowing, highly filled compound, good thermal conductivity.
applications
- • Thermal coupling of electrical devices • PCB assemblies to heat sinks
features
- • Thermally conductive compound • One part • Non flowing • No need for ovens or curing • Increases reliability with heat flow away from circuitry components
caution
- Any sliding spool valve, if held for long periods of time, may stick and not spring return due to fluid residue formation and therefore should be cycled periodically to prevent this from happening
| Type | Heat Sink |
| Evaporation Percent | 1.1% @ 390 °F |
| Container Size | 9 kg, 20 lb |
| Thickener Type | Zinc Oxide |
| Color | White |
| Temperature Range [Min] | -40 °F |
| Application | Heat Sink |
| Container Type | Pail |
| NLGI No. | 2 |
| Temperature Range [Max] | 390 °F |
| Dielectric Strength, Volts per mil | 450 |
| Base Oil | silicone |
| Weight | 19.845 LB |
